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- Fabrication and characterization of OMMt/BMI/CE composites with low dielectric properties and high thermal stability for electronic packaging
- [期刊] , 2016, 27(6): 5592-5599 EI SCIE SCOPUS
- 被引用 60 (Web of Science℠)
摘要Thermostable nanocomposites based on interpenetrating polymer network bismaleimide/cyanate ester (BMI/CE) copolymer, derived from bisphenol A dicyanate, 4,40-bismaleimidodiphenyl methane, and doped by 1-5 wt% organo-modified 2D montmorillonite (OMMt) nanoparticles were synthesized and characterized using a dielectric strength tester, concept 40 impedance analyzer, scanning electron microscope (SEM), dynamic mechanical analysis, and thermogravimetric analysis techniques. OMMt improves the dispersibility, alignment and interfacial strength of these nanocomposites, the electrical conductivity increase with increasing OMMt loading, and a suitable addition of OMMt can enhance the mechanical properties and dielectric property of BMI/CE copolymer. SEM analysis shows distinct characteristics of a ductile fracture of the blends. In addition, the OMMt/BMI/CE nanocomposites have a better thermal stability and a higher thermal conductivity compared to those of BMI/CE resin with the increasing of OMMt content. All of these changes in properties are closely correlated with the OMMt/BMI/CE nanocomposites, which could form an interaction interface structure in the system.
- In situ polymerization of modified graphene/polyimide composite with improved mechanical and thermal properties
- [期刊] , 2017, 28(1): 576-581 EI SCIE SCOPUS
- 被引用 50 (Web of Science℠)
摘要The graphene oxide was modified by coupling agent (KH-550). The polyimide/graphene treated by KH-550 (PI/KG) composite were prepared by in situ polymerization from 4,4'-diaminodiphenyl ether (ODA), 2,2-bis(4-(3,4-dicarboxyphenoxy)phenyl)propane dianhydride (BPADA), and modified graphene. The structure and morphology of the composite membranes were analyzed by Fourier transform infrared spectroscopy (FT-IR) and X ray diffraction. Compared to pure PI system, the tensile strength and elongation at break of PI/KG-4 composite, increasing by 26.4 and 24.1 %, was 134 MPa and 9.8 %, respectively. The 5 % mass loss temperature of polyimide system was about 486.1 degrees C, and the PI/KG-6 composite was 493.8 degrees C. PI/KG composites have a better thermal stability and a higher thermal conductivity compared to PI system with the increasing of KG content.