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Abstract:
The surface morphology evolution and phase structures of Cu-W thin films with annealing temperatures were investigated. The results indicate the overall agglomeration process of Cu-W thin films takes place in two distinct stages: nucleation at pores and growth of islands. Fractal dimension can describe the rough surface morphology in a quantitative way. A new and straight method integrating discrete wavelet transform and fractal geometry is presented for analyzing the anisotropy of surface structure of Cu-W thin films. Furthermore the relationship between multi-scale property of surface morphology of Cu- W thin films and phase structure transition is constructed by using it. It can be concluded that the trend of surface structure anisotropy with annealing temperatures is sensitive to the variation of phase structures.
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ACTA METALLURGICA SINICA
ISSN: 0412-1961
Year: 2005
Issue: 2
Volume: 41
Page: 123-127
0 . 3 6 6
JCR@2005
1 . 2 5 1
JCR@2020
ESI Discipline: MATERIALS SCIENCE;
JCR Journal Grade:3
CAS Journal Grade:4
Cited Count:
WoS CC Cited Count: 1
SCOPUS Cited Count:
ESI Highly Cited Papers on the List: 0 Unfold All
WanFang Cited Count:
Chinese Cited Count:
30 Days PV: 3
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