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Author:

Wang, Y (Wang, Y.) | Chen, YH (Chen, YH.) | Xu, KW (Xu, KW.) | Ma, DL (Ma, DL.) | Fan, DW (Fan, DW.)

Indexed by:

SCIE Scopus EI CSCD PKU

Abstract:

The surface morphology evolution and phase structures of Cu-W thin films with annealing temperatures were investigated. The results indicate the overall agglomeration process of Cu-W thin films takes place in two distinct stages: nucleation at pores and growth of islands. Fractal dimension can describe the rough surface morphology in a quantitative way. A new and straight method integrating discrete wavelet transform and fractal geometry is presented for analyzing the anisotropy of surface structure of Cu-W thin films. Furthermore the relationship between multi-scale property of surface morphology of Cu- W thin films and phase structure transition is constructed by using it. It can be concluded that the trend of surface structure anisotropy with annealing temperatures is sensitive to the variation of phase structures.

Keyword:

Cu-W thin film phase structure surface anisotropy wavelet transform and fractal

Author Community:

  • [ 1 ] Xian Jiaotong Univ, State Key Lab Mech Behav Mat, Xian 710049, Peoples R China
  • [ 2 ] Lanzhou Jiaotong Univ, Dept Mech Engn, Lanzhou 730070, Peoples R China
  • [ 3 ] Gansu Univ Technol, Coll Elect & Informat Engn, Lanzhou 730050, Peoples R China
  • [ 4 ] Lanzhou Jiaotong Univ, Minist Educ, Key Lab Optoelect Technol & Intelligent Control, Lanzhou 730070, Peoples R China

Reprint Author's Address:

  • Xian Jiaotong Univ, State Key Lab Mech Behav Mat, Xian 710049, Peoples R China.

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Source :

ACTA METALLURGICA SINICA

ISSN: 0412-1961

Year: 2005

Issue: 2

Volume: 41

Page: 123-127

0 . 3 6 6

JCR@2005

1 . 2 5 1

JCR@2020

ESI Discipline: MATERIALS SCIENCE;

JCR Journal Grade:3

CAS Journal Grade:4

Cited Count:

WoS CC Cited Count: 1

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 3

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