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Author:

Qian, Zheng-Hua (Qian, Zheng-Hua.) | Jin, Feng (Jin, Feng.) | Hirose, Sohichi (Hirose, Sohichi.)

Indexed by:

SCIE EI Scopus

Abstract:

An analytical approach is used to investigate the effects of covering layer thickness on the propagation behavior of Love waves in functionally graded piezoelectric materials (FGPMs) covered with a dielectric layer. The piezoelectric substrate is polarized in the direction perpendicular to the wave propagation plane, and its material parameters change continuously along the thickness direction. The dispersion equations for the existence of Love waves with respect to phase velocity are obtained for electrically open and shorted cases, respectively. A detailed investigation of the effects of the covering dielectric layer thickness on dispersion curve, phase velocity, group velocity, and electromechanical coupling factor is carried out. Numerical results show that for a given FGPM, the covering dielectric layer thickness affects significantly the fundamental mode of Love waves but has only negligible effects on the high-order modes. The changes in phase velocity, group velocity, and electromechanical coupling factor due to the change of gradient coefficient of FGPMs could be approached approximately by changing the thickness of the covering dielectric layer, which imply a potential factor for designing new-type surface wave devices with FGPMs.

Keyword:

Covering layer thickness Dispersion relation Electromechanical coupling factor Functionally graded piezoelectric materials (FGPMs) Love waves

Author Community:

  • [ 1 ] [Qian, Zheng-Hua; Hirose, Sohichi] Tokyo Inst Technol, Dept Mech & Environm Informat, Tokyo 1528550, Japan
  • [ 2 ] [Jin, Feng] Xi An Jiao Tong Univ, MOE Key Lab Strength & Vibrat, Xian 710049, Peoples R China

Reprint Author's Address:

  • Tokyo Inst Technol, Dept Mech & Environm Informat, Tokyo 1528550, Japan.

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Source :

ARCHIVE OF APPLIED MECHANICS

ISSN: 0939-1533

Year: 2011

Issue: 11

Volume: 81

Page: 1743-1755

0 . 9 5

JCR@2011

1 . 9 7 6

JCR@2020

ESI Discipline: ENGINEERING;

JCR Journal Grade:3

CAS Journal Grade:4

Cited Count:

WoS CC Cited Count: 4

SCOPUS Cited Count: 6

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 3

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