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Author:

Li, Jin (Li, Jin.) | Guo, Cheng (Guo, Cheng.) | Yu, Yang (Yu, Yang.) | Huang, Guan-Long (Huang, Guan-Long.) | Yuan, Tao (Yuan, Tao.) | Wang, Yi (Wang, Yi.) | Xu, Jun (Xu, Jun.) | Zhang, Anxue (Zhang, Anxue.)

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CPCI-S Scopus EI

Abstract:

This paper reports on a new class of broadband fully 3-D printed E-plane rectangular-coax-to-waveguide transition. This type of transition is adopted to interconnect two E-plane rectangular waveguides, and is based on a full air-filled waveguide structure without introducing other types of transmission lines (TLs). It exhibits little dielectric loss and dispersion, and furthermore a potentially enhanced power handling capability. The transition is constructed by a section of air-filled rectangular coaxial TL cascaded in series to a broadband coax-to-waveguide probe transition. A proof-of-concept X-band back-to-back transition is designed and prototyped monolithically by incorporating stereolithography-based 3-D printing and copper electroplating techniques. The RF-measured result demonstrates a broadband and low-loss characteristic of the transition-an insertion loss of averagely 0.5 dB and a return loss of mostly better than 15 dB at the entire X band.

Keyword:

3-D printed Air-filled transmission line broadband coax-to-waveguide transition E-plane rectangular coaxial line stereolithography waveguide

Author Community:

  • [ 1 ] [Li, Jin; Huang, Guan-Long; Yuan, Tao] Shenzhen Univ, Coll Informat Engn, Shenzhen 518060, Guangdong, Peoples R China
  • [ 2 ] [Guo, Cheng; Zhang, Anxue] Xi An Jiao Tong Univ, Dept Inf & Commun Engn, Xian 710049, Shanxi, Peoples R China
  • [ 3 ] [Guo, Cheng; Yu, Yang; Wang, Yi] Univ Birmingham, Dept EESE, Birmingham B15 2TT, W Midlands, England
  • [ 4 ] [Yu, Yang] Southern Univ Sci & Technol, Dept EE, Shenzhen, Peoples R China
  • [ 5 ] [Xu, Jun] UESTC, Sch Phys, Chengdu 610054, Sichuan, Peoples R China
  • [ 6 ] [Li, Jin]Shenzhen Univ, Coll Informat Engn, Shenzhen 518060, Guangdong, Peoples R China
  • [ 7 ] [Huang, Guan-Long]Shenzhen Univ, Coll Informat Engn, Shenzhen 518060, Guangdong, Peoples R China
  • [ 8 ] [Yuan, Tao]Shenzhen Univ, Coll Informat Engn, Shenzhen 518060, Guangdong, Peoples R China
  • [ 9 ] [Guo, Cheng]Xi An Jiao Tong Univ, Dept Inf & Commun Engn, Xian 710049, Shanxi, Peoples R China
  • [ 10 ] [Zhang, Anxue]Xi An Jiao Tong Univ, Dept Inf & Commun Engn, Xian 710049, Shanxi, Peoples R China
  • [ 11 ] [Guo, Cheng]Univ Birmingham, Dept EESE, Birmingham B15 2TT, W Midlands, England
  • [ 12 ] [Yu, Yang]Univ Birmingham, Dept EESE, Birmingham B15 2TT, W Midlands, England
  • [ 13 ] [Wang, Yi]Univ Birmingham, Dept EESE, Birmingham B15 2TT, W Midlands, England
  • [ 14 ] [Yu, Yang]Southern Univ Sci & Technol, Dept EE, Shenzhen, Peoples R China
  • [ 15 ] [Xu, Jun]UESTC, Sch Phys, Chengdu 610054, Sichuan, Peoples R China

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Source :

2019 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS)

ISSN: 0149-645X

Year: 2019

Page: 1209-1212

Language: English

Cited Count:

WoS CC Cited Count: 3

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 0

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