1-3　ceramic/polymer　composites　based　on　high　Curie　temperature　ferroelectric　ceramic　BiScO3-PbTiO3　(BSPT)　were　fabricated　using　the　dice　and　fill　method.　The　electromechanical　coupling　factor　k(t)　of　BSPT　composite　was　found　to　be　58%　at　room　temperature,　higher　than　the　thickness　coupling　factor　of　monolithic　BSPT　approximate　to　50%.　In　addition,　BSPT　1-3　composite　exhibits　high　thermal　stability　of　electromechanical　properties　and　low　dielectric　loss　up　to　300　degrees　C,　making　it　a　potential　candidate　for　broad-bandwidth　transducer　applications　at　elevated　temperatures.