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Author:

Sun, Ruize (Sun, Ruize.) | Liang, Y.C. (Liang, Y.C..) | Yeo, Yee-Chia (Yeo, Yee-Chia.) | Zhao, Cezhou (Zhao, Cezhou.) | Chen, Wanjun (Chen, Wanjun.) | Zhang, Bo (Zhang, Bo.)

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Abstract:

In this paper, the GaN power IC platform is developed based on Au-free AlGaN/GaN MIS-HEMTs and a constant-output-ripple all GaN DC-DC buck converter IC is firstly realized with integrated gate driver, pulse width modulation (PWM) feedback control and over-current protection (OCP) circuits. The fabricated all GaN integrated DC-DC buck converter can realize stable 10 V output with constant output ripples when input voltage varies from 15 to 30 V. The output and ripples remain stable with varying load resistance. When subjected to over-current incident, the fabricated power IC can be protected according to desired over-current threshold values. The experiment results have demonstrated the functionality and feasibility of all GaN power ICs in power conversion applications. © 2019 IEEE.

Keyword:

Aluminum gallium nitride DC-DC converters Electric inverters Gallium nitride Gold compounds High electron mobility transistors III-V semiconductors Integration Power integrated circuits Pulse width modulation Timing circuits Voltage control Wide band gap semiconductors

Author Community:

  • [ 1 ] [Sun, Ruize]State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu; 610054, China; Department of Electrical and Computer Engineering, National University of Singapore, 117580, Singapore; National University of Singapore (Suzhou) Research Institute, Suzhou; 215123, China
  • [ 2 ] [Liang, Y.C.]Department of Electrical and Computer Engineering, National University of Singapore, 117580, Singapore; National University of Singapore (Suzhou) Research Institute, Suzhou; 215123, China
  • [ 3 ] [Yeo, Yee-Chia]Department of Electrical and Computer Engineering, National University of Singapore, 117580, Singapore
  • [ 4 ] [Zhao, Cezhou]Department of Electrical and Electronic Engineering, Xi'An Jiaotong-Liverpool University, Suzhou; 215123, China
  • [ 5 ] [Chen, Wanjun]State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu; 610054, China
  • [ 6 ] [Zhang, Bo]State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu; 610054, China

Reprint Author's Address:

  • [Sun, Ruize]State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu; 610054, China;;[Sun, Ruize]Department of Electrical and Computer Engineering, National University of Singapore, 117580, Singapore;;[Sun, Ruize]National University of Singapore (Suzhou) Research Institute, Suzhou; 215123, China;;

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Source :

ISSN: 1063-6854

Year: 2019

Volume: 2019-May

Page: 271-274

Language: English

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count: 17

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 16

Affiliated Colleges:

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