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Author:

Xie, Jie (Xie, Jie.) | Yin, H. (Yin, H..) | Zhang, L. (Zhang, L..) | Ronald, K. (Ronald, K..) | Phelps, A.D.R. (Phelps, A.D.R..) | He, W. (He, W..) | Shu, G. (Shu, G..) | Zhao, J. (Zhao, J..) | Chen, X. (Chen, X..) | Alfadhl, Y. (Alfadhl, Y..) | Zhang, J. (Zhang, J..) | Cross, A.W. (Cross, A.W..)

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Abstract:

A practical numerical approach to the analysis of the effects of tolerances fabrication on the performance of a planar 0.35 THz extended interaction oscillator (EIO) is presented. The planar EIO is to be driven by pseudospark-sourced sheet electron beam. The influence of tolerance on the Q-value, resonance frequency, characteristic impedance is demonstrated using an effective value of conductivity of 1.1 × 107 S/m to take into account the skin depth and surface roughness. The method of Wire Electrical Discharge Machining (WEDM) is proposed to manufacture the 0.35 THz EIO because of its precision and moderate cost compared with other manufacturing methods such as high speed micro machining, Deep Reactive Ion Etching (DRIE) or Ultra Violet Lithographie, Galvanik, and Abformung (UV LIGA). © 2019 IEEE.

Keyword:

Electric discharge machining Electric discharges Electron beams Fabrication Micromachining Millimeter waves Surface roughness Terahertz waves

Author Community:

  • [ 1 ] [Xie, Jie]Department of Physics, SUPA, University of Strathclyde, Glasgow, Scotland; G4 0NG, United Kingdom; School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu; 610054, China
  • [ 2 ] [Yin, H.]Department of Physics, SUPA, University of Strathclyde, Glasgow, Scotland; G4 0NG, United Kingdom
  • [ 3 ] [Zhang, L.]Department of Physics, SUPA, University of Strathclyde, Glasgow, Scotland; G4 0NG, United Kingdom
  • [ 4 ] [Ronald, K.]Department of Physics, SUPA, University of Strathclyde, Glasgow, Scotland; G4 0NG, United Kingdom
  • [ 5 ] [Phelps, A.D.R.]Department of Physics, SUPA, University of Strathclyde, Glasgow, Scotland; G4 0NG, United Kingdom
  • [ 6 ] [He, W.]College of Electronic Science and Technology, Shenzhen University, Shenzhen; 518060, China
  • [ 7 ] [Shu, G.]College of Electronic Science and Technology, Shenzhen University, Shenzhen; 518060, China
  • [ 8 ] [Zhao, J.]High Voltage Division, School of Electrical Engineering, Xi'an Jiaotong University, Xi'an; 710049, China
  • [ 9 ] [Chen, X.]Department of Electronic Engineering, Queen Mary University of London, London; E1 4NS, United Kingdom
  • [ 10 ] [Alfadhl, Y.]Department of Electronic Engineering, Queen Mary University of London, London; E1 4NS, United Kingdom
  • [ 11 ] [Zhang, J.]Department of Electronic Engineering, Queen Mary University of London, London; E1 4NS, United Kingdom
  • [ 12 ] [Cross, A.W.]Department of Physics, SUPA, University of Strathclyde, Glasgow, Scotland; G4 0NG, United Kingdom

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Year: 2019

Language: English

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count: 1

ESI Highly Cited Papers on the List: 0 Unfold All

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30 Days PV: 0

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