Non-isothermal　differential　scanning　calorimetry(DSC)　method　was　used　to　study　the　curing　behavior　of　Al2O3/epoxy　(EP)　composites　for　extra-high　voltage　gas　insulated　switchgear　(GIS).　The　DSC　curves　were　subjected　to　peak　separation　treatment,　and　the　apparent　activation　energy　of　different　reaction　stages　was　studied　by　the　equal　conversion　rate　method.　According　to　the　Málek　criterion,　the　model　type　of　the　curing　behavior　of　Al2O3/EP　composites　was　obtained,　and　the　kinetic　parameters　of　different　reaction　stages　and　the　curing　kinetic　equation　of　the　Al2O3/EP　composites　were　obtained.　The　microstructure　of　Al2O3/EP　composites　was　observed　by　SEM,　dynamic　thermomechanical　properties　and　creep　behavior　of　Al2O3/EP　composites　were　analyzed　by　dynamic　mechanical　analysis(DMA),　and　the　long-term　creep　properties　were　predicted　by　time-temperature　superposition.　The　results　indicate　that　DSC　heat　flow　curves　are　bimodal　of　Al2O3/EP　composites.　The　apparent　activation　energies　of　Al2O3/EP　composites　at　two　reaction　stages　are　35.3　kJ/mol　and　48.1　kJ/mol,　respectively.　The　curing　behavior　of　Al2O3/EP　composite　system　at　different　curing　stages　can　be　well　described　by　the　Sestak-Berggren　model.　Al2O3　particles　are　uniformly　dispersed　in　the　resin　matrix,　and　the　addition　of　Al2O3　filler　causes　cracks　to　be　deflected.　The　storage　modulus　(E＇)　of　Al2O3/EP　composites　decreases　with　increasing　temperature,　and　the　peak　of　loss　tangent　(tanδ)　corresponds　to　the　glass　transition　temperature　(Tg)　is　120.03.　Creep　resistance　of　Al2O3/EP　composites　decreases　with　increase　of　tensile　stress　and　temperature.　The　creep　rate　decreases　over　time.　©　2020,　Editorial　Office　of　Acta　Materiae　Compositae　Sinica.　All　right　reserved.