Transparent　conductive　films　play　a　pivotal　role　in　advanced　optoelectronic　devices,　especially　the　flexible　optoelectronic　devices.　The　next-generation　transparent　conductive　films　require　not　only　an　optimal　trade-off　between　the　sheet　resistance　and　optical　transparency,　but　also　an　excellent　flexibility.　Although　indium　tin　oxide　(ITO)　has　been　widely　used　in　conventional　transparent　conductive　films,　the　scarcity　of　indium,　the　brittleness　and　high　sheet　resistance　of　ITO　hinder　the　further　application　in　the　emerging　flexible　optoelectronic　devices.　Among　all　the　ITO　substitutes,　metal-mesh　flexible　transparent　conductive　film　could　be　an　ideal　candidate　due　to　its　good　flexibility　and　excellent　photoelectric　properties.　However,　the　metal-mesh　usually　forms　on　the　surface　of　the　film,　leading　to　high　surface　roughness,　poor　adhesion　of　the　metal-mesh　to　the　flexible　substrate,　and　potential　electrical　short-circuits　between　the　metal-mesh　and　a　top　electrode,　which　limits　its　applications　for　highly　flexible　electronic　devices　and　optoelectronic　devices.　All　these　defects　can　be　mitigated　or　optimized　with　embedded　metal-mesh　flexible　transparent　conductive　films　to　achieve　higher　performance.　Additionally,　the　embedded　nature　of　the　metal-mesh　can　make　it　have　favorable　resistance　against　moisture,　oxygen,　and　chemicals.　But　the　fabrication　of　embedded　metal-mesh　flexible　transparent　conductive　film　is　more　challenging.　Despite　some　recent　efforts　to　address　these　challenges,　existing　fabrication　methods　are　still　complex,　with　long　cycles,　high　production　costs　and　waste　generation,　especially　they　are　difficult　to　realize　the　fabrication　of　large-area　transparent　conductive　film.　Therefore,　new　technologies　to　achieve　high-efficiency,　low-cost　fabrication　of　large-area,　highperformance　embedded　metal-mesh　flexible　transparent　conductive　film　are　needed.　This　paper　proposes　a　new　method　for　fabricating　embedded　metal-mesh　flexible　transparent　conductive　film　based　on　electric-field-driven　jet　microscale　3D　printing　and　roller-assisted　thermal　imprinting　technology.　First,　the　basic　principle　and　process　flow　of　the　fabrication　process　are　explained.　Then,　the　effects　and　rules　of　the　main　process　parameters　(printing　voltage,　printing　speed,　printing　pressure,　imprinting　temperature　and　imprinting　force)　on　the　precision　and　quality　of　the　embedded　metal-mesh　flexible　transparent　conductive　film　are　revealed　via　experiments　for　optimization　of　the　process　window.　Finally,　by　using　the　optimized　parameters　on　the　electric-field-driven　jet　deposition　micro-nano　3D　printer　and　composite　nanoimprint　lithography　machine　independently　developed　by　the　research　group,　an　embedded　square　metal-mesh　flexible　transparent　conductive　film　with　a　pattern　area　of　70　mm×70　mm,　a　line　width　of　20　μm　and　a　pitch　of　1000　μm　is　fabricated.　It　has　a　sheet　resistance　of　3.62　Ω/sq　and　a　transmittance　of　92.3%　at　a　wavelength　of　550　nm.　In　addition,　the　contact　level　of　the　metal-mesh　to　the　substrate　is　up　to　5B,　the　surface　roughness　value　is　18.81　nm,　and　the　change　rate　of　the　sheet　resistance　of　the　fabricated　embedded　metal-mesh　flexible　transparent　conductive　film　after　1000　bending　tests　is　less　than　8%.　The　research　shows　that　the　proposed　new　method　for　fabricating　embedded　metal-mesh　flexible　transparent　conductive　film　requires　simple　process　steps　and　low　production　cost.　The　transparent　conductive　film　produced　has　excellent　photoelectric　performance,　low　surface　roughness　and　good　mechanical　flexibility.　It　provides　a　promising　solution　for　high-efficiency　mass　production　of　high-performance　transparent　conductive　films.　©　2020,　Science　Press.　All　right　reserved.