SnO2-Ag　composites　with　designed　architectures　with　sub-millimeter　feature　sizes　can　provide　enhanced　functionality　in　electrical　applications.　SnO2-Ag　composites　consisting　of　a　ceramic　SnO2　micro-lattice　filled　with　metallic　Ag　are　created　via　a　hybrid　additive　manufacturing　method.　The　multistep　process　includes:　(i)　3D　extrusion　printing　of　0/90°　cross-ply　micro-lattices　from　SnO2-7%CuO　nanoparticle-loaded　ink;　(ii)　thermal　treatment　in　air　to　burn　the　binders　and　sinter　struts　of　the　SnO2　micro-lattice　to　~94%　relative　density;　(iii)　Ag　melt　infiltration　of　channels　of　sintered　micro-lattices.　Densification　of　the　SnO2　struts　during　air-sintering　is　accelerated　by　CuO　liquid　phase　forming　at　1100°C.　During　the　subsequent　Ag　infiltration,　CuO　acts　as　wetting　agent　between　Ag　and　SnO2,　with　liquid　Ag　infiltrating　the　open　channels　of　the　SnO2　lattice　and　the　micropores　in　the　SnO2　struts　left　from　incomplete　sintering,　thus　forming　a　dense　composite.　Infiltration　time　and　temperature　influence　the　structure　of　the　SnO2-Ag　interface　and　the　distribution　of　CuO　within　the　Ag　matrix.　The　resulting　anisotropic　electrical　conductivity　of　the　composite　is　controlled　by　the　low-conductivity　SnO2　architecture,　as　determined　via　finite　element　(FE)　analysis.　3D　ink-extruded　and　infiltrated　SnO2-Ag　composites　show　good　structural　stability　and　maintain　high　conductivity　upon　thermal　shock　cycles　between　850　and　20°C.　FE　analysis　reveals　that　thermal　expansion/contraction　mismatch　stresses　between　the　ceramic　and　metallic　phases　are　mostly　concentrated　at　the　contact　area　between　filaments　in　the　SnO2　microlattices,　and　that　plastic　deformation　accumulating　in　the　soft　Ag　phase　accommodates　these　mismatch　stresses　upon　thermal　cycling.　©　2020