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Author:

Wang, Dongyang (Wang, Dongyang.) | Huang, Zhiwei (Huang, Zhiwei.) | Zhang, Yang (Zhang, Yang.) | Hao, Lijie (Hao, Lijie.) | Wang, Guangtao (Wang, Guangtao.) | Deng, Sihao (Deng, Sihao.) | Wang, Hongliang (Wang, Hongliang.) | Chen, Jie (Chen, Jie.) | He, Lunhua (He, Lunhua.) | Xiao, Bao (Xiao, Bao.) | Xu, Yadong (Xu, Yadong.) | Pennycook, Stephen J (Pennycook, Stephen J.) | Wu, Haijun (Wu, Haijun.) | Zhao, Li-Dong (Zhao, Li-Dong.)

Indexed by:

EI SCIE CSCD Scopus Engineering Village

Abstract:

Materials with intrinsically low thermal conductivity are of fundamental interests. Here we report a new sort of simple one-dimensional (1D) crystal structured bismuth selenohalides (BiSeX, X = Br, I) with extremely low thermal conductivity of ∼0.27 W m−1 K−1 at 573 K. The mechanism of the extremely low thermal conductivity in 1D BiSeX is elucidated systematically using the first-principles calculations, neutron powder-diffraction measurements and temperature tunable aberration-corrected scanning transmission electron microscopy (STEM). Results reveal that the 1D structure of BiSeX possesses unique soft bonding character, low phonon velocity, strong anharmonicity of both acoustic and optical phonon modes, and large off-center displacement of Bi and halogen atoms. Cooperatively, all these features contribute to the minimal phonon transport. These findings provide a novel selection rule to search low thermal conductivity materials with potential applications in thermoelectrics and thermal barrier coatings. © 2020, Science China Press and Springer-Verlag GmbH Germany, part of Springer Nature.

Keyword:

Bismuth compounds Calculations Crystal atomic structure High resolution transmission electron microscopy Phonons Scanning electron microscopy Thermal barrier coatings Thermal conductivity

Author Community:

  • [ 1 ] [Wang, Dongyang]School of Materials Science and Engineering, Beihang University, Beijing; 100191, China
  • [ 2 ] [Huang, Zhiwei]School of Materials Science and Engineering, Beihang University, Beijing; 100191, China
  • [ 3 ] [Zhang, Yang]Instrumental Analysis Center of Xi’an Jiaotong University, Xi’an Jiaotong University, Xi’an; 710049, China
  • [ 4 ] [Zhang, Yang]Department of Materials Science and Engineering, National University of Singapore, Singapore; 117575, Singapore
  • [ 5 ] [Hao, Lijie]Department of Nuclear Physics, Neutron Scattering Laboratory, China Institute of Atomic Energy, Beijing; 102413, China
  • [ 6 ] [Wang, Guangtao]School of Physics, Henan Normal University, Xinxiang; 453007, China
  • [ 7 ] [Deng, Sihao]Spallation Neutron Source Science Center, Dongguan; 523803, China
  • [ 8 ] [Wang, Hongliang]Department of Nuclear Physics, Neutron Scattering Laboratory, China Institute of Atomic Energy, Beijing; 102413, China
  • [ 9 ] [Chen, Jie]Songshan Lake Materials Laboratory, Dongguan; 523808, China
  • [ 10 ] [He, Lunhua]Spallation Neutron Source Science Center, Dongguan; 523803, China
  • [ 11 ] [He, Lunhua]Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences, Beijing; 100190, China
  • [ 12 ] [He, Lunhua]Songshan Lake Materials Laboratory, Dongguan; 523808, China
  • [ 13 ] [Xiao, Bao]State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an; 710072, China
  • [ 14 ] [Xu, Yadong]State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an; 710072, China
  • [ 15 ] [Pennycook, Stephen J.]Department of Materials Science and Engineering, National University of Singapore, Singapore; 117575, Singapore
  • [ 16 ] [Wu, Haijun]State Key Laboratory for Mechanical Behavior of Materials, Xi’an Jiaotong University, Xi’an; 710049, China
  • [ 17 ] [Wu, Haijun]Department of Materials Science and Engineering, National University of Singapore, Singapore; 117575, Singapore
  • [ 18 ] [Zhao, Li-Dong]School of Materials Science and Engineering, Beihang University, Beijing; 100191, China

Reprint Author's Address:

  • [Zhao, Li-Dong]School of Materials Science and Engineering, Beihang University, Beijing; 100191, China;;

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Source :

Science China Materials

ISSN: 2095-8226

Year: 2020

Issue: 9

Volume: 63

Page: 1759-1768

8 . 2 7 3

JCR@2020

8 . 2 7 3

JCR@2020

ESI Discipline: MATERIALS SCIENCE;

ESI HC Threshold:84

CAS Journal Grade:3

Cited Count:

WoS CC Cited Count: 27

SCOPUS Cited Count: 43

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 7

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