With　the　continued　improvement　in　integration　and　power　density　of　electronic　devices,　it　is　difficult　to　simultaneously　achieve　excellent　temperature　uniformity　and　cooling　performance　with　the　increasing　heat　flux　of　electronic　component.　Herein,　a　multi-jet　impinging　system　with　trapezoidal　fins　and　secondary　channels,　which　can　be　used　to　efficiently　cool　the　electronic　component,　is　proposed.　The　effects　of　different　jet　arrangement　patterns　and　geometric　parameters　on　heat　transfer　in　the　heat　sinks　were　investigated　through　numerical　simulations.　Individual　parameter　analysis　was　conducted,　and　the　numerical　results　provided　deep　insight　into　heat　transfer　and　flow　mechanism.　The　unilateral　jet　arrangement　patterns　yielded　larger　heat　transfer　coefficients　and　pressure　drops,　but　the　bilateral　jet　arrangement　pattern　exhibited　better　comprehensive　performance.　The　jet　patterns　with　quasi-symmetric　flow　and　heat　transfer　features　showed　a　better　dissipation　performance,　and　the　temperature　difference　of　the　heated　surface　was　2.　To　investigate　the　influences　of　the　parameters　comprehensively,　the　Taguchi　optimization　method　was　subsequently　employed　to　analyze　their　effects　on　the　pressure　drop,　heat　transfer　coefficient,　and　overall　performance.　Finally,　the　optimal　parameter　combinations　and　contribution　ratios　were　obtained.　The　jet　pattern　and　fin　angle　demonstrated　the　largest　and　smallest　degrees　of　influence,　respectively,　among　the　optimization　objectives.　The　proposed　hybrid　heat　sink　exhibited　a　better　comprehensive　performance　than　other　types　of　heat　sinks　owing　to　the　small　product　of　the　thermal　resistance　and　pump　power.　The　study　provides　a　valuable　perspective　on　multi-jet　impinging　system　for　electronic　device　cooling.　©　2021　Elsevier　Masson　SAS