Directional　SiC/Cu-Si　composite　with　co-continuous　microstructure　was　fabricated　via　spontaneous　infiltration　of　Cu-24　at%Si　alloy　into　a　directional　porous　SiC　ceramic　produced　by　a　high　temperature　recrystallization　process.　The　initial　continuous　microstructure　of　the　directional　porous　SiC　ceramic　after　spontaneous　infiltration　can　be　maintained　and　the　as-fabricated　SiC/Cu-Si　composite　exhibits　significant　thermophysical　anisotropy,　with　higher　thermal　conductivity　(TC)　and　lower　coefficients　of　thermal　expansion　(CTE)　in　the　axial　direction.　Furthermore,　the　extent　of　TC　anisotropy　can　also　be　significantly　affected　by　the　test　temperature　besides　microstructural　anisotropy.　The　higher　the　test　temperature　is,　the　lesser　the　anisotropy　degree　of　TC　becomes.　This　can　be　attributed　to　the　varying　TC　ratio　of　the　SiC　to　the　Cu-Si　alloy　with　increased　temperature.　In　contrast,　the　temperature　has　minor　effect　on　the　anisotropy　of　CTE.　(C)　2015　Elsevier　Ltd　and　Techna　Group　S.r.l.　All　rights　reserved.