The　use　of　carbon　nanotubes　(CNTs)　as　conducting　wires　instead　of　copper　wires　for　integrated　circuits　and　very　large　scale　integration　has　become　more　and　more　important　as　their　sizes　are　being　scaled　down　and　quantum　effects　become　evident　owing　to　their　one-dimensional　structure,　excellent　electrical,　thermal　and　mechanical　properties.　Interconnect　technologies　for　CNTs　have　become　an　important　research　activity　in　recent　years　and　the　latest　research　progress　is　summarized.　Methods　include　localized　nanoscale　chemical　vapor　deposition,　electron,　ion　and　laser　beam　irradiations,　atom　force　microscopy　using　field-induced　evaporation　and　anodic　oxidation,　and　dip-pen　nanolithography　in　the　AFM　using　dynamic　exchange　between　tapping　and　lifting.