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Author:

Feng, Dan (Feng, Dan.) | Chen, Yue-Xing (Chen, Yue-Xing.) | Fu, Liang-Wei (Fu, Liang-Wei.) | Li, Ju (Li, Ju.) | He, Jia-Qing (He, Jia-Qing.)

Indexed by:

SCIE EI Scopus CSCD

Abstract:

Earth-abundant IV-VI semiconductor SnSe is regarded as a promising thermoelectric material due to its intrinsic low thermal conductivity. In this report, the highly textured SnSe/Ag2Se composites were first designed by solid solution method followed by spark plasma sintering (SPS) and their thermoelectric properties in two directions were investigated, and then, the performance of composites was further optimized with an additional ball milling. The coexistence of SnSe and Ag2Se phases is clearly confirmed by energy-dispersive X-ray spectroscopy (EDX) in transmission electron microscopy (TEM). After ball milling, the size of SnSe grains as well as the incorporated Ag2Se particles reduces effectively, which synergistically optimizes the electrical and thermal transport properties at high temperature range. As a result, a maximum ZT of similar to 0.74 at 773 K for SnSe + 1.0%Ag2Se in the direction vertical to the pressing direction is achieved. Composite engineering with additional ball milling is thus proved to be an efficient way to improve the thermoelectric properties of SnSe, and this strategy could be applicable to other thermoelectric systems.

Keyword:

Ball milling Composite engineering SnSe Thermoelectrics

Author Community:

  • [ 1 ] [Feng, Dan; Li, Ju] Xi An Jiao Tong Univ, State Key Lab Mech Behav Mat, Xian 710049, Peoples R China
  • [ 2 ] [Feng, Dan; Li, Ju] Xi An Jiao Tong Univ, Frontier Inst Sci & Technol, Xian 710049, Peoples R China
  • [ 3 ] [Feng, Dan; Chen, Yue-Xing; Fu, Liang-Wei; He, Jia-Qing] South Univ Sci & Technol China, Dept Phys, Shenzhen Key Lab Thermoelect Mat, Shenzhen 518055, Peoples R China
  • [ 4 ] [Chen, Yue-Xing; Fu, Liang-Wei] Wuhan Univ, Minist Educ, Key Lab Artificial Micro & Nano Struct, Wuhan 430072, Peoples R China
  • [ 5 ] [Chen, Yue-Xing; Fu, Liang-Wei] Wuhan Univ, Sch Phys & Technol, Wuhan 430072, Peoples R China
  • [ 6 ] [Li, Ju] MIT, Dept Nucl Sci & Engn, 77 Massachusetts Ave, Cambridge, MA 02139 USA
  • [ 7 ] [Li, Ju] MIT, Dept Mat Sci & Engn, Cambridge, MA 02139 USA
  • [ 8 ] [Feng, Dan]Xi An Jiao Tong Univ, State Key Lab Mech Behav Mat, Xian 710049, Peoples R China
  • [ 9 ] [Li, Ju]Xi An Jiao Tong Univ, State Key Lab Mech Behav Mat, Xian 710049, Peoples R China
  • [ 10 ] [Feng, Dan]Xi An Jiao Tong Univ, Frontier Inst Sci & Technol, Xian 710049, Peoples R China
  • [ 11 ] [Li, Ju]Xi An Jiao Tong Univ, Frontier Inst Sci & Technol, Xian 710049, Peoples R China
  • [ 12 ] [Feng, Dan]South Univ Sci & Technol China, Dept Phys, Shenzhen Key Lab Thermoelect Mat, Shenzhen 518055, Peoples R China
  • [ 13 ] [Chen, Yue-Xing]South Univ Sci & Technol China, Dept Phys, Shenzhen Key Lab Thermoelect Mat, Shenzhen 518055, Peoples R China
  • [ 14 ] [Fu, Liang-Wei]South Univ Sci & Technol China, Dept Phys, Shenzhen Key Lab Thermoelect Mat, Shenzhen 518055, Peoples R China
  • [ 15 ] [He, Jia-Qing]South Univ Sci & Technol China, Dept Phys, Shenzhen Key Lab Thermoelect Mat, Shenzhen 518055, Peoples R China
  • [ 16 ] [Chen, Yue-Xing]Wuhan Univ, Minist Educ, Key Lab Artificial Micro & Nano Struct, Wuhan 430072, Peoples R China
  • [ 17 ] [Fu, Liang-Wei]Wuhan Univ, Minist Educ, Key Lab Artificial Micro & Nano Struct, Wuhan 430072, Peoples R China
  • [ 18 ] [Chen, Yue-Xing]Wuhan Univ, Sch Phys & Technol, Wuhan 430072, Peoples R China
  • [ 19 ] [Fu, Liang-Wei]Wuhan Univ, Sch Phys & Technol, Wuhan 430072, Peoples R China
  • [ 20 ] [Li, Ju]MIT, Dept Nucl Sci & Engn, 77 Massachusetts Ave, Cambridge, MA 02139 USA
  • [ 21 ] [Li, Ju]MIT, Dept Mat Sci & Engn, Cambridge, MA 02139 USA

Reprint Author's Address:

  • South Univ Sci & Technol China, Dept Phys, Shenzhen Key Lab Thermoelect Mat, Shenzhen 518055, Peoples R China.

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ISSN: 1001-0521

Year: 2018

Issue: 4

Volume: 37

Page: 333-342

1 . 7 8 5

JCR@2018

4 . 0 0 3

JCR@2020

ESI Discipline: MATERIALS SCIENCE;

ESI HC Threshold:182

JCR Journal Grade:3

CAS Journal Grade:3

Cited Count:

WoS CC Cited Count: 15

SCOPUS Cited Count: 43

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 1

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