Au/NiCr/Ta　multi-layered　metallic　films　were　deposited　on　Si　substrate　by　magnetron　sputtering　at　different　substrate　temperatures.　The　residual　stress,　hardness　and　resistivity　were　investigated　as　a　function　of　substrate　temperature　by　laser　polarization　phase　shift　technique,　nanoindentation　technique　and　four　point　probe　method,　respectively.　The　residual　stress　in　as-deposited　films　at　different　substrate　temperatures　was　tension　with　385　MPa-606　MPa.　Nanoindentation　tests　at　shallow　indentation　depths　(h　＜=　t/4)　where　the　hardness　is　reliable　for　metal　films　on　hard　substrate.　Au　film　at　deposition　temperature　200　C　has　the　highest　hardness　4.2　GPa.　The　resistivity　in　the　deposited　films　reached　the　lowest　value　3.1　mu　Omega　center　dot　cm　at　substrate　temperature　200　degrees　C.　The　most　interesting　facts　are　that　the　hardness　decreases　with　increasing　residual　stress　and　resistivity　increases　with　increasing　residual　stress.　The　relationship　of　residual　stress　and　resistivity　may　hint　that　there　is　a　definite　correlation　between　the　mechanical　properties　and　electrical　properties　in　the　metallic　films.　(C)　2011　Elsevier　B.V.　All　rights　reserved.