• Complex
  • Title
  • Author
  • Keyword
  • Abstract
  • Scholars
Search
High Impact Results & Cited Count Trend for Year Keyword Cloud and Partner Relationship

Query:

学者姓名:赵玉龙

Refining:

Source

Submit Unfold

Co-Author

Submit Unfold

Language

Submit

Clean All

Export Sort by:
Default
  • Default
  • Title
  • Year
  • WOS Cited Count
  • Impact factor
  • Ascending
  • Descending
< Page ,Total 33 >
Research of a Novel 3D Printed Strain Gauge Type Force Sensor. PubMed SCIE
期刊论文 | 2019 , 10 (1) | Micromachines
Abstract&Keyword Cite

Abstract :

A 3D printed force sensor with a composite structure developed by combining digital light processing (DLP) based printing and inkjet printing technologies is described in this paper. The sensor has cost effectiveness and time-saving advantages compared to the traditional sensor manufacturing process. During this work, the substrate of the force sensor was printed by a DLP based 3D printer using a transparent high-temperature resin, and the strain gauge of the force sensor was inkjet printed using poly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT/PSS) conductive ink. Finite element (FE) simulation was conducted to find the print origin of the strain gauge. The relationship between the mechanical properties of the post-cured resin and the curing time was investigated and the resistance of the printed strain gauges was characterized to optimize process parameters. Afterward, the force sensor was characterized. Experimental results show that the sensitivity of the sensor is 2.92% N<sup>-1</sup> and the linearity error is 3.1485% full scale (FS) within the range from 0 mN⁻160 mN, and the effective gauge factor of the strain gauge is about 0.98. The resistance drifting is less than 0.004 kΩ within an hour. These figures prove that the device can perform as a force sensor and 3D printing technology may have great applied potential in sensor fabrication.

Keyword :

sensor fabrication 3D printed force sensor digital light processing inkjet printing

Cite:

Copy from the list or Export to your reference management。

GB/T 7714 Liu Mingjie , Zhang Qi , Shao Yiwei et al. Research of a Novel 3D Printed Strain Gauge Type Force Sensor. [J]. | Micromachines , 2019 , 10 (1) .
MLA Liu Mingjie et al. "Research of a Novel 3D Printed Strain Gauge Type Force Sensor." . | Micromachines 10 . 1 (2019) .
APA Liu Mingjie , Zhang Qi , Shao Yiwei , Liu Chuanqi , Zhao Yulong . Research of a Novel 3D Printed Strain Gauge Type Force Sensor. . | Micromachines , 2019 , 10 (1) .
Export to NoteExpress RIS BibTex
The Research on Actuation Performance of MEMS Safety-and-Arming Device with Interlock Mechanism. PubMed SCIE
期刊论文 | 2019 , 10 (2) | Micromachines
Abstract&Keyword Cite

Abstract :

Micro-electromechanical systems (MEMS) safety-and-arming (S&amp;A) device shows great potential in munition miniaturization, and it can be seen as the symbol of the fourth generation of weapons systems. In this paper, the design, fabrication, and actuation performance of a silicon based S&amp;A device is presented. It is a multilayer stacked device, which is composed of the cover plate, the actuation chip, and the barrel plate. The electro-thermal principle is investigated in MEMS scale. With 11 V driving voltages, the structure of V-shape actuator, pawl, and slider can generate 100 μm and 45 μm displacement, and realize pulling, disengaging, and reengaging to change the device from the safety position into armed position smoothly (550 μm displacement). The rack and interlock mechanism formed by the pawl and slider gives the device the features of linear output displacement, low power consumption, input signal recognition, and sustained displacement. The 20,000 g setback acceleration is applied, and no structure damage can be found after the impact, which indicates the good anti-load ability of the MEMS S&amp;A device. In order to solve the contradiction between the functional structure and the fabrication process, different structures are designed separately on different wafers. Both silicon and SOI wafers are used in the fabrication process, and the S&amp;A device has been minimized into 8.5 mm × 8.5 mm × 0.8 mm successfully.

Keyword :

interlock mechanism electro-thermal actuator A device MEMS S&amp

Cite:

Copy from the list or Export to your reference management。

GB/T 7714 Hu Tengjiang , Ren Wei , Zhao Yulong et al. The Research on Actuation Performance of MEMS Safety-and-Arming Device with Interlock Mechanism. [J]. | Micromachines , 2019 , 10 (2) .
MLA Hu Tengjiang et al. "The Research on Actuation Performance of MEMS Safety-and-Arming Device with Interlock Mechanism." . | Micromachines 10 . 2 (2019) .
APA Hu Tengjiang , Ren Wei , Zhao Yulong , Xue Yan . The Research on Actuation Performance of MEMS Safety-and-Arming Device with Interlock Mechanism. . | Micromachines , 2019 , 10 (2) .
Export to NoteExpress RIS BibTex
A liquid MEMS inclinometer sensor with improved sensitivity EI SCIE
期刊论文 | 2019 , 285 , 369-377 | Sensors and Actuators, A: Physical
Abstract&Keyword Cite

Abstract :

This paper proposes a liquid microelectromechanical system (MEMS) inclinometer sensor and reports its design, fabrication, and characterization. In the sensor, a liquid metal droplet moves inside an annular-shaped channel, driven by gravity. The position of the liquid metal is reflected by electrodes and the new tilting angle is obtained. A MEMS fabrication process has been developed, and characterisation of the sensor has been carried out. Experiments show that the sensor has a resolution of 3.625° and a wide measuring range of ±45°. In comparison with solid MEMS gyroscopes, the proposed liquid sensor has advantages of fewer manufacturing steps and low costs. Beside, its resilience against impact is outstanding. Its sensitivity and accuracy are more than sufficient for hand held electronics, which are the main targeted applications of the proposed liquid sensor. © 2018 Elsevier B.V.

Keyword :

Liquid metal droplets Liquid sensors Measuring ranges MEMS fabrication MEMS gyroscope Micro electromechanical system (MEMS) Sliding angle Superhydrophobic

Cite:

Copy from the list or Export to your reference management。

GB/T 7714 Xu, Han-yang , Zhao, Yu-long , Zhang, Kai et al. A liquid MEMS inclinometer sensor with improved sensitivity [J]. | Sensors and Actuators, A: Physical , 2019 , 285 : 369-377 .
MLA Xu, Han-yang et al. "A liquid MEMS inclinometer sensor with improved sensitivity" . | Sensors and Actuators, A: Physical 285 (2019) : 369-377 .
APA Xu, Han-yang , Zhao, Yu-long , Zhang, Kai , Wang, Zi-xi , Jiang, Kyle . A liquid MEMS inclinometer sensor with improved sensitivity . | Sensors and Actuators, A: Physical , 2019 , 285 , 369-377 .
Export to NoteExpress RIS BibTex
IMPACT EXPERIMENT ANALYSIS OF MEMS ULTRA-HIGH G PIEZORESISTIVE SHOCK ACCELEROMETER EI CPCI-S Scopus
会议论文 | 2018 , 964-967 | 31st IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
WoS CC Cited Count: 1
Abstract&Keyword Cite

Abstract :

A novel ultra-high g shock micro accelerometer with four self-supporting piezoresistive micro beams was proposed to simultaneously enhance the sensor performance of sensitivity and frequency response. The finite element method (FEM) simulations indicated that the pure axial deformations could occur on self-supporting piezoresistive micro beams via optimizing structure dimensions. And the average stress distribution in piezoresistive beams was 81.5 MPa, the natural frequency of sensor was about 505.00 kHz. To verify the sensitivity and natural frequency of fabricated shock accelerometer, impact tests were carried out using Hopkinson pressure bar under impact loads of 100,000 g. The results were obtained in the form of response curves of a shock signal. Then, the average sensitivity was calculated as 1.586 mu V/g/3V, and the natural frequency was obtained as 445 kHz by fast Fourier transform. The experimental results agreed well with the FEM simulations except for a slight mismatch in natural frequency which was probably resulted from the errors of device fabrication and package processes. The experiment results reliably demonstrate that the proposed shock accelerometer, with high natural frequency and high sensitivity, is capable of measuring ultra-high g loading shock.

Cite:

Copy from the list or Export to your reference management。

GB/T 7714 Jia, Chen , Zhao, Libo , Jiang, Weile et al. IMPACT EXPERIMENT ANALYSIS OF MEMS ULTRA-HIGH G PIEZORESISTIVE SHOCK ACCELEROMETER [C] . 2018 : 964-967 .
MLA Jia, Chen et al. "IMPACT EXPERIMENT ANALYSIS OF MEMS ULTRA-HIGH G PIEZORESISTIVE SHOCK ACCELEROMETER" . (2018) : 964-967 .
APA Jia, Chen , Zhao, Libo , Jiang, Weile , Liu, Xixiang , Yu, Mingzhi , Huang, Mimi et al. IMPACT EXPERIMENT ANALYSIS OF MEMS ULTRA-HIGH G PIEZORESISTIVE SHOCK ACCELEROMETER . (2018) : 964-967 .
Export to NoteExpress RIS BibTex
EFFECT OF MOLECULAR WEIGHT AND CONCENTRATION ON GEL-SPUN UHMWPE FIBERS WITH POLYBUTENE AS A NEW SPIN SOLVENT EI CPCI-S Scopus
会议论文 | 2018 , 8 | ASME International Mechanical Engineering Congress and Exposition
Abstract&Keyword Cite

Abstract :

Ultrahigh molecular weight polyethylene (UHMWPE) fibers have been investigated for years to improve performance with gel spinning process for wide applications in industry. Various spin solvents have been attempted including paraffin oil, decahydronaphthalene (decalin), kerosene etc. However, more work still needs to be done because of environmental issues or long extraction process of the aforementioned solvents. Recently, polybutene was found to be an effective spin solvent for UHMWPE fibers, which is environmentally friendly and widely available on the market. Besides producing high strength fibers, compared to paraffin oil, polybutene can form a gel with UHMWPE showing stronger phase separation behavior at room temperature. Because of this property, more extraction solvents can be saved. It was also demonstrated with experiments that the extraction efficiency is higher than that of the gel fiber formed with paraffin oil. Thus, polybutene has high potential to be used in large-scale production of UHMWPE fibers, which deserves further study. In this work, polybutene with different molecular weight was used to form spin dopes with UHMWPE. The dope concentration for each type of polybutene was also varied to check the effect of molecular weight and dope concentration on fiber properties. Viscoelastic properties of the spin dopes were obtained with parallel plate rheometry while thermodynamic properties of the dopes were characterized with differential scanning calorimetry (DSC) and thermal gravitational analysis (TGA). With optimized processing conditions, high strength fibers were collected and the crystalline structure was examined with wide angel X-ray diffraction (WAXD). DSC and TGA data also provided support for the effect of molecular weight and concentration of polybutene. It can be found that stronger fibers are obtained with lower concentration spin dopes. The viscosity of the dopes and corresponding spinning conditions are significantly affected by molecular weight of polybutene. Extraction efficiency is affected by both molecular weight and dope concentration. To obtain cost-effective superstrong UHMWPE fibers, an optimized design is needed based on the molecular weight of polybutene and the spin dope concentration.

Cite:

Copy from the list or Export to your reference management。

GB/T 7714 Fang, Xudong , Jing, Weixuan , Zhao, Libo et al. EFFECT OF MOLECULAR WEIGHT AND CONCENTRATION ON GEL-SPUN UHMWPE FIBERS WITH POLYBUTENE AS A NEW SPIN SOLVENT [C] . 2018 : 8 .
MLA Fang, Xudong et al. "EFFECT OF MOLECULAR WEIGHT AND CONCENTRATION ON GEL-SPUN UHMWPE FIBERS WITH POLYBUTENE AS A NEW SPIN SOLVENT" . (2018) : 8 .
APA Fang, Xudong , Jing, Weixuan , Zhao, Libo , Zhao, Yulong , Jiang, Zhuangde . EFFECT OF MOLECULAR WEIGHT AND CONCENTRATION ON GEL-SPUN UHMWPE FIBERS WITH POLYBUTENE AS A NEW SPIN SOLVENT . (2018) : 8 .
Export to NoteExpress RIS BibTex
Adhesion behavior between multilayer graphene and semiconductor substrates SCIE Scopus
期刊论文 | 2018 , 8 (11) | Applied Sciences (Switzerland)
Abstract&Keyword Cite

Abstract :

© 2018 by the authors. A high bonding strength between graphene and a semiconductor surface is significant to the performance of graphene-based Micro-Electro Mechanical Systems/Nano-Electro Mechanical Systems (MEMS/NEMS) devices. In this paper, by applying a series of constant vertical upward velocities (Vup) to the topmost layer of graphene, the exfoliation processes of multilayer graphene (one to ten layers) from an Si semiconductor substrate were simulated using the molecular dynamics method, and the bonding strength was calculated. The critical exfoliation velocities, adhesion forces, and adhesion energies to exfoliate graphene were obtained. In a system where the number of graphene layers is two or three, there are two critical exfoliation velocities. Graphene cannot be exfoliated when the Vup is lower than the first critical velocity, although the total number of graphene layers can be exfoliated when the Vup is in the range between the first critical velocity and second critical velocity. Only the topmost layer can be exfoliated to be free from the Si surface if the applied Vup is greater than the second critical velocity. In systems where the number of graphene layers is four to ten, only the topmost layer can be free and exfoliated if the exfoliation velocity is greater than the critical velocity. It was found that a relatively low applied Vup resulted in entire graphene layers peeling off from the substrate. The adhesion forces of one-layer to ten-layer graphene systems were in the range of 25.04 nN-74.75 nN, and the adhesion energy levels were in the range of 73.5 mJ/m2-188.45 mJ/m2. These values are consistent with previous experimental results, indicating a reliable bond strength between graphene and Si semiconductor surfaces.

Keyword :

Adhesion energy Adhesion force Bonding mechanism Exfoliation behavior Graphene MEMS/NEMS Molecular dynamics

Cite:

Copy from the list or Export to your reference management。

GB/T 7714 Zhang, Qi , Ma, Xin , Zhao, Yulong . Adhesion behavior between multilayer graphene and semiconductor substrates [J]. | Applied Sciences (Switzerland) , 2018 , 8 (11) .
MLA Zhang, Qi et al. "Adhesion behavior between multilayer graphene and semiconductor substrates" . | Applied Sciences (Switzerland) 8 . 11 (2018) .
APA Zhang, Qi , Ma, Xin , Zhao, Yulong . Adhesion behavior between multilayer graphene and semiconductor substrates . | Applied Sciences (Switzerland) , 2018 , 8 (11) .
Export to NoteExpress RIS BibTex
An improved structural design for accelerometers based on slotted eight-beam structure EI SCIE Scopus
期刊论文 | 2018 , 38 (1) , 1-8 | SENSOR REVIEW
Abstract&Keyword Cite

Abstract :

Purpose - The purpose of this paper is proposed a new structure design for high performance accelerometer. Design/methodology/approach - An improved sensitivity structure considering sensitivity, natural frequency and cross-axis sensitivity is established and realized. The proposed structure was designed to improve the trade-off between the sensitivity and the natural frequency of piezoresistive accelerometer and eliminate the lateral sensitivity effect by the specific configuration, which is made possible by incorporating slots into the eight-beam structure. The mechanical model and its mathematical solution are established for calculating the sensitivity and natural frequency behavior of the designed structure. The developed sensor is fabricated on the n-type single-crystal silicon wafer and packaged for experiment. The accelerometer prototype was tested in the centrifugal machine and dynamic calibration system. Findings - The experimental results show that the sensitivity of the designed sensor is 0.213 mV/(Vg) and the natural frequency of the sensor is 14.22 kHz. Compared with some piezoresistive accelerometers in literatures, the designed sensor possesses a suitable characteristic in sensitivity, natural frequency and transverse effect, which allows its usage in measuring high frequency vibration signals. Originality/value - The accelerometer with slotted eight-beam structure shows a good performance in the static and dynamic experiments and can be used in measuring high frequency vibration signals.

Keyword :

Accelerometer MEMS Slotted beam Structural design

Cite:

Copy from the list or Export to your reference management。

GB/T 7714 Wang, Peng , Zhao, Yulong , Zhao, You et al. An improved structural design for accelerometers based on slotted eight-beam structure [J]. | SENSOR REVIEW , 2018 , 38 (1) : 1-8 .
MLA Wang, Peng et al. "An improved structural design for accelerometers based on slotted eight-beam structure" . | SENSOR REVIEW 38 . 1 (2018) : 1-8 .
APA Wang, Peng , Zhao, Yulong , Zhao, You , Zhang, Qi , Cai, Anjiang . An improved structural design for accelerometers based on slotted eight-beam structure . | SENSOR REVIEW , 2018 , 38 (1) , 1-8 .
Export to NoteExpress RIS BibTex
Study on bonding mechanism of graphene on silicon substrate SCIE Scopus
期刊论文 | 2018 , 32 (23) , 12 | MODERN PHYSICS LETTERS B
Abstract&Keyword Cite

Abstract :

The study of bonding mechanism is important for the application of graphene in microelectro-mechanical system (MEMS). Using molecular dynamics (MD) simulation, the adhesion behavior of graphene on silicon substrate was observed, by applying a constant vertical upward exfoliation velocity to graphene. The effects of silicon substrate size, graphene layer number and exfoliation velocity on adhesion properties of graphene were studied. The minimum velocity to exfoliate monolayer graphene was 4.3 angstrom/ps, and the maximum adhesive force was 25.04 nN. For two-layer graphene, velocity was applied on the top layer, 5.2 angstrom/ps and 12 angstrom/ps were the critical velocities: when the velocity was no more than 5.2 angstrom/ps, the top layer cannot be exfoliated; as the velocity was in the range of 5.2-12 angstrom/ps, the second layer was driven upward together with the top layer, because of interlayer interaction between graphene layers; when the velocity increased greater than 12 angstrom/ps, the top layer graphene was broken through the bonding forces of substrate and the second layer, and exfoliated alone. It can be concluded that the velocity to exfoliate graphene was extremely high, and the adhesion energy was 299.81 mJ/m(2) and 323.41 mJ/m(2) for exfoliating monolayer and two-layer graphene respectively, thus the adhesive strength between graphene and silicon was very strong.

Keyword :

adhesion behavior Bonding mechanism exfoliation graphene MEMS/NEMS molecular dynamics

Cite:

Copy from the list or Export to your reference management。

GB/T 7714 Zhang, Qi , Zhao, Yulong , Ma, Xin et al. Study on bonding mechanism of graphene on silicon substrate [J]. | MODERN PHYSICS LETTERS B , 2018 , 32 (23) : 12 .
MLA Zhang, Qi et al. "Study on bonding mechanism of graphene on silicon substrate" . | MODERN PHYSICS LETTERS B 32 . 23 (2018) : 12 .
APA Zhang, Qi , Zhao, Yulong , Ma, Xin , Zhao, You , Pang, Xing . Study on bonding mechanism of graphene on silicon substrate . | MODERN PHYSICS LETTERS B , 2018 , 32 (23) , 12 .
Export to NoteExpress RIS BibTex
A closed-form approach for the resonant frequency analysis of clamped rectangular microplates under distributed electrostatic force EI SCIE Scopus
期刊论文 | 2018 , 280 , 447-458 | SENSORS AND ACTUATORS A-PHYSICAL
Abstract&Keyword Cite

Abstract :

This paper proposes a fast-converged reduced-order model for small vibrations of electrostatically actuated rectangular microplates around their deformed states. On this foundation, one-mode analysis method and thus closed-form analytical expressions are developed for the fundamental resonant frequency analysis. Numerical multi-mode analysis is conducted to investigate the convergence. It is concluded that the one-mode analysis method can give a converged solution, which demonstrates that the proposed model has a faster convergence than previous models where multi modes are needed. The directly calculated resonant frequencies by the closed-form expressions are in good agreement with the numerical results by FEM simulations with less than 5% variation before pull-in. Parametric study shows the closed-form expressions are applicable to the cases in which the thickness is less than 1/20 of the length and width under a nominal length to width ratio of 1 similar to 2.5, and the gap distance is less than or equal to the thickness of the microplate. Additionally, a kind of electrostatic configurations based on multilayer microplates, capacitive micromachined ultrasonic transducers (CMUTs), were used to experimentally validate the closed-form expressions and good agreement was observed. (C) 2018 Elsevier B.V. All rights reserved.

Keyword :

Multilayer microplates Electrostatic microplates One-mode analysis Reduced-order model Resonant frequency Closed-form expressions

Cite:

Copy from the list or Export to your reference management。

GB/T 7714 Li, Zhikang , Zhao, Libo , Jiang, Zhuangde et al. A closed-form approach for the resonant frequency analysis of clamped rectangular microplates under distributed electrostatic force [J]. | SENSORS AND ACTUATORS A-PHYSICAL , 2018 , 280 : 447-458 .
MLA Li, Zhikang et al. "A closed-form approach for the resonant frequency analysis of clamped rectangular microplates under distributed electrostatic force" . | SENSORS AND ACTUATORS A-PHYSICAL 280 (2018) : 447-458 .
APA Li, Zhikang , Zhao, Libo , Jiang, Zhuangde , Zhao, Yihe , Li, Jie , Zhang, Jiawang et al. A closed-form approach for the resonant frequency analysis of clamped rectangular microplates under distributed electrostatic force . | SENSORS AND ACTUATORS A-PHYSICAL , 2018 , 280 , 447-458 .
Export to NoteExpress RIS BibTex
高精度石英振梁谐振式传感器测试系统设计 CSCD PKU
期刊论文 | 2018 , (6) , 5-10 | 仪表技术与传感器
Abstract&Keyword Cite

Abstract :

为了满足高精度石英振梁谐振式传感器的测试要求,设计了一种基于FP GA的带实时温度监测的双路等精度频率采集系统.系统采用Verilog语言模块化编程方法实现双路等精度测频原理和ⅡC实时通讯,然后运用基于FP GA的SOP C技术完成自定义测频测温IP核的封装,并通过调用各种IP核构建SOPC硬件,最后利用NiosⅡ软核处理器实现频率值和温度值的浮点解算、LCD显示、串口通讯等功能.该设计方案通过仿真和实验验证了测试系统以50 Hz采样频率运行时,测频精度达到了10-6.

Keyword :

石英振梁谐振式传感器 等精度测频 温度监测 FPGA 数据采集

Cite:

Copy from the list or Export to your reference management。

GB/T 7714 孙登强 , 赵玉龙 , 李波 et al. 高精度石英振梁谐振式传感器测试系统设计 [J]. | 仪表技术与传感器 , 2018 , (6) : 5-10 .
MLA 孙登强 et al. "高精度石英振梁谐振式传感器测试系统设计" . | 仪表技术与传感器 6 (2018) : 5-10 .
APA 孙登强 , 赵玉龙 , 李波 , 李村 , 韩超 . 高精度石英振梁谐振式传感器测试系统设计 . | 仪表技术与传感器 , 2018 , (6) , 5-10 .
Export to NoteExpress RIS BibTex
10| 20| 50 per page
< Page ,Total 33 >

Export

Results:

Selected

to

Format:
FAQ| About| Online/Total:2593/65149756
Address:XI'AN JIAOTONG UNIVERSITY LIBRARY(No.28, Xianning West Road, Xi'an, Shaanxi Post Code:710049) Contact Us:029-82667865
Copyright:XI'AN JIAOTONG UNIVERSITY LIBRARY Technical Support:Beijing Aegean Software Co., Ltd.