A　strategy　based　on　wavelet　transform　to　describe　surface　morphology　of　thin　films　is　presented　in　this　paper.　The　evolution　of　surface　morphology　of　Cu-W　thin　films　with　deposition　time　on　silicon　wafers　was　investigated　by　discrete　wavelet　transform　(DWT)　method.　The　results　show　that　the　surface　morphology　of　the　thin　films　is　unstable　until　the　sputtering　time　exceeds　10　min.　The　surface　morphology　variation　of　different　thin　films　can　be　distinguished　primarily　by　high　frequency　signals.　A　scattering　of　the　nanoindentation　hardness　values,　which　results　from　the　roughness　of　the　thin　films　surface,　can　be　characterized　by　the　roughness　defined　by　the　surface　texture　based　on　wavelet　transform.