Previous　experimental　tests　[Thin　Solid　Films　516:　1925-1930]　have　shown　that　nano-cantilever　Si/Cu/SiN/Pt/C　tends　to　delaminate　along　the　interface　between　Cu　and　Si　layers　when　subject　to　monotonically　bending　load,　the　measured　load-displacement　curve　shows　a　clear　nonlinear　behavior.　Based　on　the　continuum　mechanics　model,　this　study　carries　out　numerical　simulation　and　analysis　of　the　crack　initiation　and　propagation　along　the　interface　Si/Cu,　which　was　observed　in　the　above　tests.　Exponential　type　cohesive　zone　model(CZM)　using　finite　element　method　was　adopted　to　characterize　the　constitutive　relationship　of　the　interface　Si/Cu,　where　Cu　layer　obeys　either　linear　elastic　or　Ramberg-Osgood　elasto-plastic　constitutive　relationship.　The　characteristic　parameters　of　interface　bonding　strength　are　extracted　through　calibration　via　experimental　results.　The　simulation　results　show　that　(i)　cohesive　strength　and　cohesive　energy　are　the　dominating　CZM　parameters,　and　exponential　CZM　is　suitable　to　describe　the　interfacial　delamination　between　Cu　and　Si　layers　when　Cu　layer　is　linear　elastic;　(ii)　compared　with　bulk　Cu,　nano-scale　Cu　has　a　much　higher　yield　stress　and　hardening　rate,　which　leads　to　little　plastic　deformation　of　the　nano-cantilever　specimen　during　the　whole　delamination　process.　These　predictions　are　in　accordance　with　the　experimental　results.