The　interface　strength　of　Pb(Zr,　Ti)O3(PZT)　thin　films　on　a　silicon　substrate　is　studied　experimentally　and　numerically　in　this　work.　First,　a　sandwiched　cantilever　specimen　is　proposed　to　perform　the　delamination　tests.　The　experimental　results　show　that　the　multilayered　Cr/PZT/PLT/Pt/Ti　thin　films　deposited　on　single-crystal　silicon　substrates　are　delaminated　along　the　interface　between　Cr　and　PZT　layers　in　a　brittle　manner.　Second,　based　on　cohesive　zone　models　(CZMs),　numerical　simulations　are　carried　out　to　extract　the　fracture　toughness　of　the　interface　Cr/PZT.　Three　types,　exponential,　bilinear　and　trapezoidal,　of　CZMs　are　adopted.　Characteristic　CZM　parameters　are　obtained　through　comparisons　with　experimental　results.　The　simulation　results　indicate　that　(i)　cohesive　strength　and　work　of　separation　are　the　dominating　parameters　in　the　CZMs;　(ii)　the　bilinear　CZM　is　more　suitable　in　describing　this　brittle　interfacial　delamination;　and　(iii)　compared　with　typical　film/coating　materials　of　several　millimetre　thicknesses,　the　fracture　energy　of　this　weak　interface　Cr/PZT　is　quite　low.　Our　study　demonstrates　a　methodology　of　how　to　measure　and　determine　the　interface　bonding　strength　parameter　of　PZT　thin　films,　which　will　be　useful　for　assessing　the　structural　integrity　and　reliability　of　PZT　devices.　©　Springer　Science+Business　Media　B.V.　2011.