Ti　metal　coating　was　prepared　on　Al2O3ceramic　substrate　with　Ti　and　I2powders　as　raw　materials　via　chemical　vapor　deposition　based　on　the　principle　of　haloids　reduction.　The　influences　of　processing　parameters　(i.　e.,　mass　ratio　of　Ti　to　I2,　temperature　and　time)　on　the　deposition　were　investigated.　The　phase　composition　of　the　coating　was　analyzed　by　X-ray　diffraction.　The　microstructure　morphology　and　composition　of　the　coating　was　analyzed　by　scanning　electron　microscopy　with　energy　dispersives　pectrometry.　The　wettability　between　the　copper　and　coated　alumina　was　investigated　via　a　sessile　drop　test.　The　results　show　that　the　Ti　coating　on　alumina　substrate　can　be　obtained　at　the　mass　ratio　Ti　to　I2of　1:3　and　1100°C　for　60　min.　The　Ti　coating　obtained　has　a　high　purity　and　an　obvious　predominant　orientation　of　(110)　crystal　plane.　The　combination　between　the　coating　and　the　ceramic　appear　fine.　The　contact　angle　between　copper　and　the　coating　at　1113°C　is　57°.