This　paper　presents　the　new　design　and　fabricating　process　of　a　packaged　micro　piezoelectric　vibration　energy　harvester　(PVEH).　Structures　are　designed　and　parameters　are　optimized　through　finite　element　modelling　and　analysis.　The　double　L-shaped　tungsten　proof　mass　block　and　thick　copper-based　PZT　bimorph　are　proposed　to　ensure　the　harvester　with　high　electrical　power.　Polymethyl　methacrylate　(PMMA)　packaging　and　epoxy　resin　bonding　supply　the　flexible　clamping　of　piezoelectric　cantilever,　which　decreases　the　resonant　frequency,　increase　average　PZT　stress,　reduces　the　maximum　PZT　stress　and　broadens　the　effective　frequency　range.　Bulk　PZT　bonding　is　used　in　PVEH　prototype　fabrication.　Experimental　results　show　that　the　packaged　PVEH　resonates　under　the　excitation　of　1　g　(9.8　m　s(-2))　at　160　Hz.　It　has　an　optimum　resistance　load　of　47　k　Omega.　More　importantly,　its　maximum　output　power　is　2.49　mW　in　experiments,　and　the　half-power　bandwidth　is　22　Hz.　After　package,　it　has　a　high　volume　power　density　of　0.64　mW/cm(3)　g(2)　with　the　volume　of　3.9　cm(3)　(2　cm　x　1.5　cm　x　1.3　cm).　Connected　with　energy　harvesting　circuit,　PVEH　can　light　up　a　light　emitting　diode　(LED)　under　broadband　vibration　frequency.　The　proposed　PVEH　with　broadband　output　power　in　mW　level　is　promised　to　power　up　some　microelectronic　devices　for　application.　(C)　2019　Elsevier　B.V.　All　rights　reserved.