The　influence　of　surface　topography　on　adhesion　hysteresis　of　thin　film　was　studied.　The　Cu/Ti　bilayer　thin　film　was　fabricated　using　dc　magnetron　sputtering　technology　and　its　surface　adhesion　force　was　measured　using　force-displacement　curves　of　AFM.　The　experiment　results　show　that　the　unload　curve　exhibits　obvious　adhesion　hysteresis.　The　theoretical　analysis　on　the　influence　of　thin　film　roughness　to　the　adhesion　hysteresis　was　carried　out　using　JKR　model.　The　results　show　that　the　load　curve　and　unload　curve　constitute　a　closed　curve　and　that　the　smoother　the　surface,　the　more　obvious　adhesion　hysteresis　(that　is,　the　rougher　the　surface,　the　less　obvious　adhesion　hysteresis).　©　2019　IEEE.