Electrically　conductive　adhesives　(ECAs)　are　widely　used　in　electronics　and　silver-based　ECA　is　one　of　the　most　typical　representatives.　In　this　work,　a　trinary　silver-based　filler　strategy　was　proposed　to　achieve　ECAs　with　high　conductivity　and　low　silver　content,　where　silver　fractal　flowers　(Ag-FWs)　were　used　to　set　up　the　conductive　framework　and　silver　nanowires　(Ag-NWs)　and　silver　nanoflakes　(Ag-NFs)　were　added　to　connect　the　separated　domains　and　fill　the　small　gaps,　respectively.　The　ECAs　reached　a　low　electrical　resistivity　of　6.0　×　10−5　Ω　cm　and　high　adhesion　strength　of　13.5　MPa　when　the　addition　of　Ag-FWs,　Ag-NWs　and　Ag-NFs　were　50　wt%,　7.5　wt%　and　2.5　wt%,　respectively,　superior　to　those　reported　ECAs　of　80　wt%　silver　loading.　Besides,　the　ECA　circuit　fabricated　by　3D　printer　demonstrated　good　electrical　conductivity　and　resistance　stability.　The　preparation　idea　of　ECAs　brings　novel　opportunities　for　the　development　of　the　electronic　packaging　industries.　©　2020　Elsevier　Ltd