3D　electronic　packaging　printer　can　realize　the　transformation　of　electronic　packaging　from　2D　to　3D,　and　it　is　a　very　important　new　device　in　the　electronic　industry.　The　amplification　structure　is　the　key　part　of　it.　In　this　paper,　by　means　of　geometric　calculation,　computer　aided　design　and　simulation,　an　improved　rhombic　3D　design　drawing　and　key　design　parameters　of　the　amplification　structure　are　obtained.　The　rhombic　amplification　structure　is　simulated　by　finite　element　simulation　method,　and　the　simulation　amplification　coefficient　is　9.05,　which　is　consistent　with　the　design　amplification　coefficient　of　9.36.　The　displacement　output　diagram　and　stress　cloud　diagram　show　that　the　displacement　and　strength　of　the　rhombic　amplified　structure　conform　to　the　service　requirements　of　3D　electronic　packaging　printer.　©　2020　Institute　of　Physics　Publishing.　All　rights　reserved.