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Author:

Liu, Hongguang (Liu, Hongguang.) | Zhang, Jun (Zhang, Jun.) | Xu, Xiang (Xu, Xiang.) | Jiang, Yifei (Jiang, Yifei.) | He, Yong (He, Yong.) | Zhao, Wanhua (Zhao, Wanhua.) (Scholars:赵万华)

Indexed by:

SCIE EI Scopus

Abstract:

Microstructure evolution of materials has an important effect on chip formation and fracture process, which is also essential for revealing the mechanism of high-speed cutting. Complex microstructures would make it difficult in analyzing the deformation procedure during cutting process. As a result, in this study, oxygen-free high-conductivity (OFHC) copper, including coarse grains and single phase, is chosen for workpiece material to be machined with high-speed cutting experiments for revealing the cutting mechanisms. Chips and chip roots of OFHC copper under orthogonal cutting conditions with increasing cutting speeds from 750m/min to 3000m/min are collected. The microstructure and fracture characteristics of collected chips are observed by electron backscatter diffraction (EBSD) and scanning electron microscope (SEM), respectively. The results show that the grain refinement and dynamic recrystallization (DRX) are both generated during the cutting process, which lead to the strengthening of mechanical properties and the fracture transformation from ductile to brittle. This research explains the effect of microstructure evolution, especially the transformation of grain itself, on the chip formation and fracture mechanisms.

Keyword:

Chip formation Chip fracture EBSD High-speed cutting Microstructure evolution

Author Community:

  • [ 1 ] [Liu, Hongguang; Zhang, Jun; Xu, Xiang; Jiang, Yifei; He, Yong; Zhao, Wanhua] Xi An Jiao Tong Univ, State Key Lab Mfg Syst Engn, Xianning West Rd 28, Xian 710049, Peoples R China
  • [ 2 ] [Liu, Hongguang]Xi An Jiao Tong Univ, State Key Lab Mfg Syst Engn, Xianning West Rd 28, Xian 710049, Peoples R China
  • [ 3 ] [Zhang, Jun]Xi An Jiao Tong Univ, State Key Lab Mfg Syst Engn, Xianning West Rd 28, Xian 710049, Peoples R China
  • [ 4 ] [Xu, Xiang]Xi An Jiao Tong Univ, State Key Lab Mfg Syst Engn, Xianning West Rd 28, Xian 710049, Peoples R China
  • [ 5 ] [Jiang, Yifei]Xi An Jiao Tong Univ, State Key Lab Mfg Syst Engn, Xianning West Rd 28, Xian 710049, Peoples R China
  • [ 6 ] [He, Yong]Xi An Jiao Tong Univ, State Key Lab Mfg Syst Engn, Xianning West Rd 28, Xian 710049, Peoples R China
  • [ 7 ] [Zhao, Wanhua]Xi An Jiao Tong Univ, State Key Lab Mfg Syst Engn, Xianning West Rd 28, Xian 710049, Peoples R China

Reprint Author's Address:

  • Xi An Jiao Tong Univ, State Key Lab Mfg Syst Engn, Xianning West Rd 28, Xian 710049, Peoples R China.

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Source :

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

ISSN: 0268-3768

Year: 2017

Issue: 1-4

Volume: 91

Page: 823-833

2 . 6 0 1

JCR@2017

3 . 2 2 6

JCR@2020

ESI Discipline: ENGINEERING;

ESI HC Threshold:121

JCR Journal Grade:3

CAS Journal Grade:3

Cited Count:

WoS CC Cited Count: 8

SCOPUS Cited Count: 10

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 3

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