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Numerical simulation of polysilicon deposition characteristics in chemical vapor deposition process

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Author:

An, Lisha (An, Lisha.) | Yang, Zhe (Yang, Zhe.) | Liu, Yingwen (Liu, Yingwen.) | Unfold

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Scopus SCOPUS

Abstract:

© 2018 Society of Thermal Engineers of Serbia. This paper addresses the complex component evolution and silicon dynamic deposition characteristics in the traditional Siemens reactor. A two-dimensional heat and mass transfer model coupled with a detailed chemical reaction mechanism was developed. The distributions of temperature, velocity, and concentration are presented in detail. The influencing factors (such as feeding mole ratio, inlet velocity, base temperature and reactor pressure) on the molar concentration evolutions of ten major components and silicon growth rate were obtained and analyzed. Results show that base temperature is main influence of HCl mole fraction. In order to get more growth rate of silicon and better silicon quality, the complex operating parameters need to be reasonably designed on collaborative optimization.

Keyword:

Chemical vapor deposition Deposition characteristics Polycrystalline silicon

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Source :

Thermal Science

ISSN: 0354-9836

Year: 2018

Volume: 22

Page: 719-727

1 . 5 4 1

JCR@2018

1 . 5 7 4

JCR@2019

ESI Discipline: ENGINEERING;

ESI HC Threshold:108

JCR Journal Grade:3

CAS Journal Grade:4

Cited Count:

WoS CC Cited Count: 0

30 Days PV: 5

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