In　this　paper,　a　novel　packaging　method　which　features　wirebond-less　structure　by　using　flexible　printed　circuit　board　(FPCB)　are　presented.　Detailed　comparisons　are　also　conducted　with　the　wirebonding　hybrid　packaging　structure　in　a　half-bridge　(HB)　module.　The　results　reveal　the　better　performances　of　the　FPCB　packaging　method　in　smaller　parasitic　inductances,　less　switching　losses,　better　thermal　stability.　Compared　with　the　wirebonding　packaging　structure,　the　parasitic　inductances　in　power　loop　and　gate　loop　decrease　by　52%　and　76%　respectively.　The　double　pulse　test　(DPT)　was　established　in　simulation　to　compare　the　switching　losses　which　decreases　by　22%　relatively.　Furthermore,　the　simulation　is　conducted　by　Finite　Element　Analysis　(FEA),　and　the　temperature　of　the　FPCB　structure　decreases　by　20°C.　This　paper　also　focuses　on　the　reliability　of　solder　layer　between　FPCB　and　DBC　substrate.　In　general,　it　clearly　manifests　that,　the　FPCB　packaging　structure　has　smaller　parasitic　inductances,　better　thermal　performance　and　reliability.　©　2018　IEEE.