The　fragmentation　and　interfacial　stress　transfer　of　Cu75Zr25　amorphous　films　with　varying　film　thickness　(h)　on　polyimide　substrates　were　systematically　investigated　by　using　uniaxial　tensile　testing,　in　combination　with　in　situ　optical　microscope　and　atomic　force　microscope　characterizations.　It　is　revealed　that　the　interfacial　stress　transfer　length　increases　monotonically　as　h　increases.　The　interfacial　stress　transfer　mechanism　changes　from　elastic-plastic　to　approximately　linear　elastic　at　a　critical　point　of　h　=　250　nm.　This　is　related　to　h-dependent　deformation-induced　devitrification　(DID)　near　the　interfaces　that　the　thinner　Cu-Zr　amorphous　films　display　more　DID.　This　study　elucidates　for　the　first　time　the　effect　of　DID　on　the　interfacial　stress　transfer,　which　will　be　helpful　to　design　the　interface　with　desired　property　for　nanotechnological　applications.　(C)　2019　Elsevier　B.V.　All　rights　reserved.