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Author:

Xu, W. (Xu, W..) | Lu, T. J. (Lu, T. J..) (Scholars:卢天健) | Wang, F. (Wang, F..)

Indexed by:

SCIE EI Scopus

Abstract:

Polymer-supported metal films as interconnects for flexible, large area electronics may rupture when they are stretched, and the rupture strain is strongly dependent upon the film/substrate interfacial properties. This paper investigates the influence of interfacial properties on the ductility of polymer-supported metal films by modeling the microstructure of the metal film as well as the film/substrate interface using the method of finite elements and the cohesive zone model (CZM). The influence of various system parameters including substrate thickness. Young's modulus of substrate material, film/ substrate interfacial stiffness, strength and interfacial fracture energy on the ductility of polymer-supported metal films is systematically studied. Obtained results demonstrate that the ductility of polymer-supported metal films increases as the interfacial strength increases, but the increasing trend is affected distinctly by the interfacial stiffness. (C) 2010 Elsevier Ltd. All rights reserved.

Keyword:

Cohesive zone model Ductility Flexible substrate Interface Metal film

Author Community:

  • [ 1 ] [Xu, W.; Lu, T. J.; Wang, F.] Xi An Jiao Tong Univ, MOE Key Lab Strength & Vibrat, Xian 710049, Peoples R China

Reprint Author's Address:

  • 卢天健

    Xi An Jiao Tong Univ, MOE Key Lab Strength & Vibrat, Xian 710049, Peoples R China.

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Source :

INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES

ISSN: 0020-7683

Year: 2010

Issue: 14-15

Volume: 47

Page: 1830-1837

1 . 6 7 7

JCR@2010

3 . 9 0 0

JCR@2020

ESI Discipline: ENGINEERING;

JCR Journal Grade:2

CAS Journal Grade:2

Cited Count:

WoS CC Cited Count: 27

SCOPUS Cited Count: 31

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 1

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