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In situ polymerization of modified graphene/polyimide composite with improved mechanical and thermal properties

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摘要

The graphene oxide was modified by coupling agent (KH-550). The polyimide/graphene treated by KH-550 (PI/KG) composite were prepared by in situ polymerization from 4,4'-diaminodiphenyl ether (ODA), 2,2-bis(4-(3,4-dicarboxyphenoxy)phenyl)propane dianhydride (BPADA), and modified graphene. The structure and morphology of the composite membranes were analyzed by Fourier transform infrared spectroscopy (FT-IR) and X ray diffraction. Compared to pure PI system, the tensile strength and elongation at break of PI/KG-4 composite, increasing by 26.4 and 24.1 %, was 134 MPa and 9.8 %, respectively. The 5 % mass loss temperature of polyimide system was about 486.1 degrees C, and the PI/KG-6 composite was 493.8 degrees C. PI/KG composites have a better thermal stability and a higher thermal conductivity compared to PI system with the increasing of KG content.

作者机构

[Wu, Guanglei; Wang, Kuikui] Qingdao Univ, Coll Mat Sci & Engn, Growing Base State Key Lab, Inst Mat Energy & Environm, Qingdao 266071, Peoples R China
[Wu, Guanglei; Cheng, Yonghong; Wang, Zhengdong] Xi An Jiao Tong Univ, Sch Elect Engn, State Key Lab Elect Insulat & Power Equipment, CNRE, Xian, Peoples R China
[Feng, Ailing] Baoji Univ Arts & Sci, Inst Phys & Optoelect Technol, Baoji 721016, Peoples R China
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